14-AMI
The 14AMI project is dedicated to the development of state-of-the-art 14 angstrom semiconductor chips produced using EUV lithography.
EUV lithography uses ultraviolet radiation in the extreme ultraviolet range to create tiny structures on silicon wafers. This advanced technique makes it possible to fit more transistors and circuits on a single chip. This is crucial to keep pace with the growing demands of the semiconductor industry and to comply with Moore's Law.
However, EUV lithography also brings technical challenges, such as the production of EUV-exposed masks and the precise handling of extremely short-wavelength radiation.
The main objective of the 14AMI project is to promote the development and deployment of state-of-the-art EUV lithography tools. The project is carried out by a consortium of 31 research institutions and covers a wide range of research areas. The focus is on lithography, metrology and process module integration.
In lithography, we are working on solutions for the 0.55 NA EUV scanner platform to ensure performance and optics for the 14 angstrom node. This includes the development of adaptive EUV mirror technology and optimizations in terms of optics lifetime and throughput.
At the University of Wuppertal, we are specifically working on the interaction of EUV-induced plasma and surfaces of optical components. We are developing analytical tools designed for the detection of EUV-induced plasma and vacuum as well as for plasma types in EUV lithography applications. This analytical technology is critical to deepening understanding in this challenging environment and helping to improve optics lifetime.
